• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present patent application discloses an adhesive ultra-thin full-color LED thin-film display screen, which belongs to the field of LED display; the technical solutions of the present patent application is that an adhesive ultra-thin full-color LED thin-film display screen comprises a thin-fllm display screen body, a plurality of LED die sets, a plurality of driving IC non-packed chips and an FPC flexible interface circuit board. Each LED die set comprises three LED dies which are red LED die, green LED die and blue LED die respectively, characterized in that said thin-film display screen body consists of a light emitting layer, a first adhesive layer, a second adhesive layer, a third adhesive layer, a front protective layer of the light emitting layer, a back protective layer of the light emitting layer and a protective layer of adhesive layer; the patent application has the beneficial effects that by reversely pasting a RGB die and a driving IC with no encapsulation on a conductive thin-film substrate which can be bent or even folded, large-scale and industrialization of the ultra-thin full color LED thin-film display screen can be achieved.
    公开号:NL2018339A
    申请号:NL2018339
    申请日:2017-02-08
    公开日:2017-04-24
    发明作者:Zhiqin Lin；Zijun Liu
    申请人:Shanghai Tiegetech；
    IPC主号:
    专利说明:

    An adhesive ultra-thin full-color LED thin-film display screen
    TECHNIC AL FIELD
    The present patent application relates to the field of LED display, and particularly relates to an adhesive ultra-thin Hill-color LED thin-film display screen.
    BACKGROUND LED display screen is widely used in many aspects of production and life of modern society due to the advantages of energy saving, environmental protection, firm structure and long life-span. The brightness of the LED display screen is high, and may be greater than 20000 cd/'rrf when used outdoors. Thus, the LED display screen is the unique large-scale display terminal which can be used in all-weather outdoors. When used indoors, its series products, such as small-pitch high-definition screen, all-in one machine for advertisement and teaching, dual-use security monitoring device and flexible LED display screen, etc., are leading the technical innovation and emerging market development.
    Flexible LED display screen is taken as an example. Although some new technologies such as OLED (organic light-emitting diode) in the similar technical field achieve the screen characteristic of partly flexibility and variability, they are different technical solutions from the flexible thin-film LED display screen and cannot address the technical problem of upsizing the display screen and extending the life-span.
    In the field of LED display, it is required that the LED display screen is convenient to be transported, assembled and disassembled, and has light and thin screen body and variable shapes. In order to achieve this purpose, it is common practice in the prior art to reduce the unit case size. However, due to the size limit of the structure such as the integrated outer frame, the power supply system, the controlling system, the packaged LED chip and the packaged driving chip of the LED display screen, the technical effect is not evident. As a result, the display screen has granular sensation and the display effect is deteriorated.
    To address the above-discussed deficiencies of the prior art, it is an object of the present patent application to provide an adhesive ultra-thin full-color LED thin-film display screen with light and thin screen body and variable shapes, convenient to be transported, assembled and disassembled, and meanwhile with the material saved, the production cost reduced, and the production efficiency improved.
    The inventive concept of the patent application is that a transparent thin-film is used as a substrate and an ITO or copper foil is used as a conductive medium to replace a conventional PCB, an LED die with no encapsulation and a driving chip are used to replace a conventional packaged LED and a driving chip. An LED can be directly adhesively mounted to form a display screen by giving up the outer frame, hanging the direct current power supply and the controlling system out, using FPC as an interface circuit and pasting the glue on the backside of a module. Because the shape of a thin-film is variable and can be bent and even folded, it is possible to obtain the shape that cannot be realized in the existing LED display screen. And because a thin-film itself is very light and thin, the display unit module can be ultra-thin and ultra-light. Under the same transport conditions as the existing LED display screen, an LED display screen with larger scale can be transported. The assembly, disassembly and transportation costs can be reduced and the material can be saved. Because of its structure characteristic, the aforementioned adhesive ultra-thin full-color LED thin-film display screen can get a larger permanent adhesion by a smaller initial adhesion, so that the LED thin-film display screen has a better surface roughness and is not easy to fall off.
    An adhesive ultra-thin full-color LED thin-film display screen comprises a thin-film display screen body, a plurality of LED die sets, a plurality of driving IC non-packaged chips and an FPC flexible interface circuit board. Each LED die set comprises three LED dies which are red LED die, green LED die and blue LED die respectively. Said thin-film display screen body consists of a light emitting layer, a first adhesive layer, a second adhesive layer, a third adhesive layer, a front protective layer of the light emitting layer, a back protective layer of the light emitting layer and a protective layer of adhesive layer.
    Said light emitting layer comprises one or more thin-film LED display unit and one or more interface unit comprising an FPC interface circuit.
    Said thin-film LED display unit comprises a unit connection mechanism. Said unit connection mechanism comprises a connecting plate comprising 12 pads that are symmetrically arranged. Each pad has a pad hole. Said connecting plate is arranged with 4 location holes.
    Said each thin-film LED display unit is provided with two location holes.
    The external size of the said driving IC non-packaged chip is 0.8mm x 1.0mm.
    One end of said FPC flexible interface circuit board is connected to said thin film LED display unit, and the other end is connected to a power supply case. Said power case comprises a mounting system card, a signal adapter plate and a DC power supply. A size of said ultra-thin full-color LED thin-film display screen is 3 00mm x 3 00mm, 3 00mm χ 600mm, 3 00mm x 1200mm, 600mm x 600mm, óOOnimx 1200mm, 600mmx2400mm, or 1200mmx2400mm.
    Said protective layer of adhesive layer is a piece of paper having a thickness of 0.077mm.
    The patent application has the beneficial effects that: by reversely pasting a RGB die and a driving IC with no encapsulation on a conductive thin-film substrate which can be bent or even folded, large-scale and industrialization of the ultra-thin full color LED thin-film display screen can be achieved; because the driver IC with no encapsulation is a kind of single-line, three-channel, non-packaged constant current LED driving IC, in which a digital filter, an MCU single-line digital interface, a data latch, a constant current LED driver and a PWM grayscale control circuit are integrated, external controller can control the chips with single wire by dual-channel input and output digital interface cascade, simplifying the structure and saving the material; by means of a standby communication port, the function that the damage of one chip in the cascade does not affect the normal use of the subsequent stage(s) is achieved; its small volume further reduces the overall weight of the thin-film display screen, so that a larger permanent adhesion is obtained through a smaller initial adhesion and the thin-film display screen can be flatly attached through adhesive layers to any media surface that can be pasted and not be easy to fall off; by using the paper with a thickness of 0.077mm as the protective layer of the adhesive layer, the adhesive layer can be protected, reducing the weight of the thin-film display screen, protecting the LED thin-film display screen, the LED dies and the panel circuits, and protecting the photosensitive components of the LED thin-film display screen; the display unit signal and power interface circuit of the thin-film display screen is leaded out by the FPC interface circuit, so that the structure of the display screen panel is simple, the failure rate is reduced and the maintenance is convenient; through the display unit connection mechanism, full-color LED thin-film display screen can be seamlessly spliced into a large display screen which has any dimension within the range of thousands of square meters to tens of thousands of square meters and whose staicture can be changed variably; and compared to the existing LED display screen, the cost is reduced, the material is saved and the production efficiency of the transportation, installation and production line is improved.
    Hence, the invention provides amongst others an adhesive ultra-thin full-color LED thin-film display screen, which belongs to the field of LED display; the technical solutions of the present patent application is that an adhesive ultra-thin full-color LED thin-film display screen comprises a thin-film display screen body, a plurality of LED die sets, a plurality of driving IC non-packed chips and an FPC flexible interface circuit board. Each LED die set comprises three LED dies which are red LED die, green LED die and blue LED die respectively, characterized in that said thin-film display screen body consists of a light emitting layer, a first adhesive layer, a second adhesive layer, a third adhesive layer, a front protective layer of the light emitting layer, a back protective layer of the light emitting layer and a protective layer of adhesive layer; the patent application has the beneficial effects that by reversely pasting a RGB die and a driving IC with no encapsulation on a conductive thin-film substrate which can be bent or even folded, large-scale and industrialization of the ultra-thin full color LED thin-film display screen can be achieved.
    Further, the invention provides amongst others the following embodiments, which are only numbered for the sake of referencing:
    1. An adhesive ultra-thin full-color LED thin-film display screen comprising a thin-film display screen body, a plurality of LED die sets, a plurality of driving IC non-packed chips and an FPC flexible interface circuit board, each LED die set comprising three LED dies, the three LED dies being red LED die, green LED die and blue LED die, respectively, characterized in that said thin-film display screen body consists of a light emitting layer, a first adhesive layer, a second adhesive layer, a third adhesive layer, a front protective layer of the light emitting layer, a back protective layer of the light emitting layer and a protective layer of adhesive layer. 2. The adhesive ultra-thin full-color LED thin-film display screen according to embodiment 1, characterized in that said light emitting layer comprises one or more thin-film LED display unit and one or more interface unit comprising an FPC interface circuit. 3. The adhesive ultra-thin full-color LED thin-film display screen according to embodiment 2, characterized in that said thin-film LED display unit comprises a unit connection mechanism comprising a connecting plate comprising 12 pads symmetrically arranged, each pad having a pad hole, said connecting plate being arranged with 4 location holes. 4. The adhesive ultra-thin full-color LED thin-film display screen according to embodiment 3, characterized in that said each thin-film LED display unit is provided with two location holes. 5. The adhesive ultra-thin Hill-color LED thin-film display screen according to any one of the preceding embodiments, characterized in that the external size of said driving IC non-packed chip is 0.8mm χ 1.0mm. 6. The adhesive ultra-thin full-color LED thin-film display screen according to any one of the preceding embodiments, characterized in that one end of said FPC flexible interface circuit board is connected to said thin-film LED display unit, and the other end is connected to a power case comprising a mounting system card, a signal adapter plate and a DC power supply. 7. The adhesive ultra-thin full-color LED thin-film display screen according to any one of the preceding embodiments, characterized in that the size of said ultra-thin full-color LED thin-film display screen is 300mm X 300mm, 300mmX600mm, 300mmX 1200mm, óOOnmiX600mm, 600mmX 1200mm, 600mm X 2400mm, or 1200mm X 2400mm. 8. The adhesive ultra-thin full-color LED thin-film display screen according to any one of the preceding embodiments, characterized in that said protective layer of adhesive layer is a piece of paper having a thickness of 0.077mm. 9. The adhesive ultra-thin full-color LED thin-film display screen according to any one of the preceding embodiments, characterized in that said thin-film display screen uses an ITO or copper as a conductive medium and a sheet resistance of a thin-film substrate of an ITO coating pattern circuit is less than or equals to 3.5 ohms.
    BRIEF DESCRIPTION OF THE DRAWINGS
    Figure 1 is a schematic sectional staicture view of a front pasted LED thin-film display screen body of the present patent application.
    Figure 2 is a schematic sectional structure view of a back pasted LED thin-film display screen body of the present patent application.
    Figure 3 is a schematic front structure view of a main panel of a LED thin-film display screen of the embodiment 1 of the present patent application. Figure 4 is a schematic sectional structure view taken along the line A-A in Fig. 3.
    Fig. 5 is a schematic structure diagram of a display unit module of the present patent application.
    Figure 6 is a schematic diagram of a unit connection mechanism of a thin-film LED display unit, wherein Figure 6A is a schematic diagram of two units aligned to be connected; Figure 6B is a schematic diagram of a structure of a connecting plate; Figure 6C is a schematic structure view after connecting the two units of Figure 6Ato the connecting plate of Figure 6.
    Figure 7 is a schematic diagram of a unit module circuit of the thin-film LED display unit of the present patent application.
    Figure 8 is a schematic diagram of the FPC interface circuit diagram of the LED thin-film display screen of the present patent application.
    Wherein, the reference numerals are listed as follows: 1. protective layer of adhesive layer; 2. first adhesive layer; 3. front protective layer of light emitting layer; 4. second adhesive layer; 5. light emitting layer; 6. third adhesive layer; 7. back protective layer of light emitting layer; 8. LED module; 9. main panel of LED thin-film display screen; 10.FPC flexible interface circuit board; 11. signal adapter plate; 12.power supply case; 13.power supply; 14.plug connector; 15.thin-film LED display unit; 16,pad;17. location hole; 18.pad hole;19.LED die sets;20.connecting plate. DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to clearly describe the technical features of the present invention, the present invention will be described below by way of specific embodiments without limiting the scope of the patent application.
    Embodiment 1
    Referring to figures 1-8, the present patent application is an adhesive ultra-thin full-color LED thin-film display screen comprising a thin-film display screen body, a plurality of LED die sets 19, a plurality of driving IC non-packaged chips and an FPC flexible interface circuit board 10. Each LED die set 19 comprises three LED dies which are red LED die, green LED die and blue LED die respectively. The thin-film display screen body consists of a light emitting layer 5, a first adhesive layer 2, a second adhesive layer 4, a third adhesive layer 6, a front protective layer of the light emitting layer 3, a back protective layer of the light emitting layer 7 and a protective layer of adhesive layer 1.
    The composite layers of the aforementioned thin-film display screen body are the back protective layer of the light emitting layer 7, the third adhesive layer 6, the light emitting layer 5, the second adhesive layer 4, the front protective layer of the light emitting layer 3, the first adhesive layer 2 and the protective layer of adhesive layer 1 from bottom to top in order.
    The aforementioned front protective layer of the light emitting layer 3 can be implemented as a polarizer, and then light exits through a phase retardation plate to realize the 3D function of the LED thin-film display screen.
    An ITO or copper foil is used as a conductive medium in the ultra-thin full-color LED thin-film display screen to replace the conventional PCB. An ITO coating pattern circuit is formed on a thin-film substrate by sputtering and evaporating process. The sheet resistance of the thin-film substrate of the ITO coating pattern circuit is less than or equals to 3.5 ohms.
    The second adhesive layer 4 comprises active carbon fiber, wherein the pore volume content of the active carbon fiber is 1-10%, so that the LED thin-film display screen has better corrosion resistance and electric and thermal conductivity. When the display screen is used in outdoors, because the brightness of the LED screen is high, the possible visual pollution can be greatly reduced when the active carbon fiber having the pore volume content of 3.5% is added. Meanwhile, in the medical or military fields, the screen can be used as a defense screen taking advantage of its electromagnetic shielding. The light emitting layer 5 comprises one or more thin-film LED display unit 15 and one or more interface unit comprising an FPC interface circuit.
    The thin-film LED display unit 15 comprises a unit connection mechanism comprising a connecting plate 20 on which four location holes 17 are arranged.
    The connecting plate 20 comprises 12 pads 16 that are symmetrically arranged, each pad 16 has a pad hole 18 thereon, and each thin-film LED display unit 15 has two location holes 17 thereon.
    [0036]The external size of the driving IC non-packaged chip is 0.8mm * 1.0mm.
    One end of said FPC flexible interface circuit board 10 is connected to the thin-film LED display unit 15, and the other end is connected to a power case 12.
    The power case 12 comprises a mounting system card, a signal adapter plate 11 and a DC power supply 13. A size of the ultra-thin full-color LED thin-film display screen is 300mm*300mm, 300mm*600mm> 300mmχ 1200mm, 600mmx600mm. 600mm* 1200mm, 600mm*2400mm, or 1200mm*2400mm.
    The protective layer of adhesive layer is a piece of paper having a thickness of 0.077mm.
    The work principle of the driving IC non-packaged chip in the adhesive ultra-thin full-color LED thin-film display screen is as follows:
    After the chip has been powered-on and reset, ICll(Din 1) is tacitly approved to receive data at first. As long as the chip detects that there is a signal input in the port, the port is kept to receive the data. If the port has not received the data for more than 60s, IC12(Din2) is switched to receive data. As long as the chip detects that there is a signal input in this port, the port IC12(Din2) is kept to receive the data. If this port has not received the data for more than 60s, ICll(Dinl) is switched to receive data again. IC 11 (Dinl) and IC12 (Din2) are switched circularly to receive data as such.
    After the chip has been powered-on and reset and received the constant current value setting command, the PWM setting command is started to be received. After 24 bit have been received, IC16(Doutl) and IC15(Dout2) ports start to forward the data continuously sent from ICll(Dinl) port or IC12(Din2) port to provide PWM setting command to the next cascade chip. Before forwarding the data, IC16(Doutl) port and IC15(Dout2) port are at low level all the time. If Reset signal is input into the IC11 (Dinl) and IC12 (Din2) port, IC19(R), IC 18(G), IC 17(B) ports of the chip output the received 24-bit data causing the corresponding LED (001,002,003) to emit light of different colors according to the PWM waveforms with the corresponding duty cycle and the chip waits for receiving new data again. After receiving the previous batch of 24-bit data, the data is forwarded through IC 16 (Doutl) and IC15 (Dout2) port. Before receiving the Reset signal, the original output from IC19(R), IC 18(G), IC17(B)remains unchanged.
    The chip uses automatic shaping and forwarding technology, thus the signal will not distort and decay. For all the chips cascaded together, the cycles of the data transmission are the same.
    The main panel 9 of the LED thin-film display screen of the present embodiment may be compositely added with a transparent secure material such as a waterproof layer, an antistatic layer, a fireproof layer, and the like on the basis of the thin-film display screen body.
    The above FPC flexible interface circuit board 10 can achieve three effects of transparency, translucency or opacity.
    The two thin-film LED display units 15 described above in FIG. 6A are accurately positioned by the four location holes 17 provided in the connecting plate 20. By means of solder or by filling the pad holes 18 in the pads 16 with solder paste, the three can be connected together. The thin-film LED display unit 15 and the connecting plate 20 are both PCB board having a thickness of 0.1mm, thus the overall thickness of the unit connection mechanism is less than or equals to 0.3mm after the connection is cured.
    The technical features not described in the present patent application can be realized by adopting the prior art, no more tautology here, and the above description is not limited to the patent application. The present patent application is not limited to the above-mentioned examples. Those skilled in the art will recognize that variations, modifications, additions or substitutions within the scope of the patent application are intended to be included within the scope of the present patent application.
    权利要求:
    Claims (9)
    [1]
    1. An adhesive ultra-thin full-color LED thin-film display comprising a thin-film display body, a plurality of LED sets, a plurality of control IC chips without housing and an FPC flexible interface circuit card, each LED comprising three LED dies, wherein the three LEDs are, respectively, a red LED which is, a green LED which is and a blue LED which is characterized in that the thin-film display body consists of a light-emitting layer, a first adhesive layer, a second adhesive layer, a third adhesive layer, a front side-protected layer of the light-emitting layer, a rear-side protective layer of the light-emitting layer, and a protective layer of the adhesive layer.
    [2]
    The adhesive ultra-thin full-color LED thin-film display according to claim 1, characterized in that the light-emitting layer comprises one or more thin-film LCD units and one or more interface units comprising an FCP interface circuit.
    [3]
    The adhesive ultra-thin full-color LED thin-film display according to claim 2, characterized in that the thin-film LED display unit comprises a unit connecting mechanism comprising a connecting plate comprising 12 symmetrically arranged cams, each cam having a cam opening, the connecting plate is configured with 4 location openings.
    [4]
    The adhesive ultra-thin full-color LED thin-film display according to claim 3, characterized in that said each thin-film LCD display unit is provided with 2 location openings.
    [5]
    The adhesive ultra-thin full-color LED thin-film display according to claim 1, characterized in that the external size of the driving IC chips without housing is 0.8 mm x 1.0 mm.
    [6]
    The adhesive ultra-thin full-color LED thin-film display according to claim 1, characterized in that one end of the FPC flexible interface circuit card is connected to the thin-film LED display unit, and the other end is connected to a power supply cover comprising a mounting system card, a signal adapter plate and a DC power source.
    [7]
    The adhesive ultra-thin full-color LED thin-film display according to claim 1, characterized in that the size of the ultra-thin full-color LED thin-film display is 300 mm x 300 mm, 300 mm x 600 mm, 300 mm x 200 mm, 600 mm x 600 mm, 600 mm x 1200 mm, 600 mm x 2400 mm, or 1200 x 2400 mm.
    [8]
    The adhesive ultra-thin full-color LED thin-film display according to claim 1, characterized in that the protective layer of the adhesive layer is a piece of paper with a thickness of 0.077 mm.
    [9]
    The adhesive ultra-thin full-color LED thin-film display according to claim 1, characterized in that the thin-film display uses an ITO or copper as a conductive medium and a layer resistance of a thin-film substrate of an ITO coating pattern circuit is less than or is equal to 3.5 ohms.
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    同族专利:
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    引用文献:
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    WO2008023893A1|2006-08-24|2008-02-28|Lg Innotek Co., Ltd|Light source apparatus and liquid crystal display having the same|
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    CN106228912B|2016-07-29|2019-07-30|上海铁歌科技有限公司|A kind of ultra-thin all-colour LED film display screen of Pasting|
    CN109817104A|2019-01-08|2019-05-28|长春希达电子技术有限公司|A kind of LED array of display mould group of thin-film package|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    CN201620804478.4U|CN205722655U|2016-07-29|2016-07-29|A kind of ultra-thin all-colour LED thin film display screen of Pasting|
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